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資深硬件工程師
20000-29000元 應(yīng)屆畢業(yè)生 本科
  • 全勤獎
  • 節(jié)日福利
  • 不加班
  • 周末雙休
中國惠普有限公司 2024-11-08 23:16:46 509人關(guān)注
職位描述
該職位還未進(jìn)行加V認(rèn)證,請仔細(xì)了解后再進(jìn)行投遞!
RESPONSIBILITIES: ? Construct the product system architecture with the ability to make interdisciplinary trade-offs to optimize for the best cost/performance/time. ? Responsible for headset electrical detailed design (including test and debug) with cross-function team and ODM supplier, conduct design review before design release for production tooling ? Define product requirements and specifications (mechanical, electrical, acoustic, firmware) and test document as necessary to ensure desired quality and performance of the product ? Building an efficient communication bridge to ODM supplier with worldwide development teams across multiple disciplines (Product Manager, QA, Ops, 3rd party supplier etc.) ? Provide global technical support to other non-engineering functions on key technologies and past, present, and future products ? Develop new technologies/technology platforms REQUIREMENTS ? 6 years experience in product development of electronic products, 2 years experience as a lead of ODM projects is a must. ? Bachelor degree in electrical engineering discipline or similar. ? Strong consumer electronic industrial background. Wireless and audio working experience will be a plus. ? Rich design experience for high volume manufacture of consumer electronic product. ? EDA experience in validating schematic and PCB/A layout, prototype bring-up and debugging between Engineering team and ODM, lead team to meet requirement of EMC/EMI, ESD, RF, reliability etc. ? Thorough understanding of, and ability to clearly explain, EE concepts such as A/D, DC/DC supply, RF gain compression, EMI noise suppression techniques, SWR and power measurement ? Strong electrical engineering background with clear understanding of software/firmware development. Track record of learning and understanding other engineering disciplines (software, firmware, mechanical, acoustic) ? Broad exposure to many engineering disciplines: Electrical, Mechanical, Software, Systems, Acoustics ? Strong written and oral communication skills in both English and Mandarin, and strong interpersonal skills ? Ability to work with others in a widely-disbursed, fast-paced team environment ? Excellent time management and organizational skills HIGHLY DISIRERABLE ? Experience/knowledge of RF design and antenna design for wireless systems ? Experience /knowledge of embedded system design and coding ? Experience working with global engineering team and product management to define products and make tradeoffs ? Experience mentoring junior engineers for technical skills and soft skills
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注:聯(lián)系我時,請說是在江南人才網(wǎng)上看到的。
工作地點
地址:蘇州蘇州工業(yè)園區(qū)蘇州-工業(yè)園區(qū)繽特力通訊科技公司
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